Semiconductor packages and display devices including the same

ABSTRACT

Semiconductor packages are provided. A semiconductor package includes a substrate including a first bonding region, a chip region, and a second bonding region. Moreover, the substrate includes first and second surfaces that are opposite to each other. The semiconductor package includes a pad group including a pad on the first surface in the chip region. The semiconductor package includes a semiconductor chip on the pad group. The semiconductor package includes a wire connecting the pad and the second bonding region. The wire includes a portion that extends along the second surface of the substrate. Related display devices are also provided.

This application claims priority to Korean Patent Application No.10-2018-0014978, filed on Feb. 7, 2018, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the disclosure of which is herebyincorporated herein by reference in its entirety.

BACKGROUND

The present disclosure relates to semiconductor packages and displaydevices including the same. As electronic products have increasinglybecome compact in size, thin, and lightweight, tape film packages havebeen suggested as high-integration density semiconductor chip attachmenttechnology. Examples of the tape film packages include a tape carrierpackage and a chip-on film (COF) package.

In the COF package, a semiconductor chip may be bonded directly on asubstrate by flip-chip bonding and may be connected to an externalcircuit via wires. Since fine wire patterns can be formed in the COFpackage, the COF package has drawn attention as a high-integrationdensity package.

SUMMARY

Example embodiments of the present disclosure provide a compactsemiconductor package, such as a COF semiconductor package and a displaydevice including the COF semiconductor package. Accordingly, exampleembodiments of the present disclosure may provide a compact displaydevice.

However, the inventive concepts of the present disclosure are notlimited to the example embodiments set forth herein. The above and otherexample embodiments of the present disclosure will become more apparentto one of ordinary skill in the art to which the present disclosurepertains by referencing the detailed description of the presentdisclosure given below.

According to some example embodiments of the present disclosure, thereis provided a semiconductor package a film substrate including a firstbonding region, a chip region, and a second bonding region that are in asequence in a first direction. The film substrate may further includefirst and second surfaces that are opposite to each other. Thesemiconductor package may include a pad group that may include first,second, and third pads on the first surface in the chip region andspaced apart from each other in a second direction that intersects thefirst direction. The semiconductor package may include a firstsemiconductor chip on the pad group on the first surface. Thesemiconductor package may include a second semiconductor chip on thefirst surface in the chip region, and in a sequence in the seconddirection together with the first semiconductor chip, adjacent the firstpad. The semiconductor package may include a first wire connecting thefirst pad and the second bonding region. The semiconductor package mayinclude a second wire connecting the second pad and the first bondingregion. The semiconductor package may include a third wire connectingthe third pad and the second bonding region. The first wire may includea first via that penetrates the film substrate, a first extended portionthat connects the first pad and the first via, and a second extendedportion that connects the first via and the second bonding region andextends along the second surface of the film substrate.

According to some example embodiments of the present disclosure, thereis provided a semiconductor package including a film substrate includinga first bonding region, a chip region, and a second bonding region thatare in a sequence in a first direction. The film substrate may furtherinclude first and second surfaces that are opposite to each other. Thesemiconductor package may include a first pad group including first andsecond pads that are on the first surface in the chip region and arespaced apart from each other in a second direction that intersects thefirst direction. The semiconductor package may include a second padgroup including a third pad that is on the first surface in the chipregion and is spaced apart in the second direction from the second padwith the first pad therebetween. The semiconductor package may include afirst semiconductor chip on the first pad group. The semiconductorpackage may include a second semiconductor chip on the second pad groupand adjacent the first semiconductor chip in the second direction. Thesemiconductor package may include a first wire including a first viathat penetrates the film substrate, a first extended portion thatconnects the first pad and the first via, and a second extended portionthat connects the first via and the second bonding region and extendsalong the second surface of the film substrate. The semiconductorpackage may include a second wire connecting the second pad and thefirst bonding region. The semiconductor package may include a third wireincluding a second via that penetrates the film substrate, a thirdextended portion that connects the third pad and the second via, and afourth extended portion that connects the second via and the secondbonding region and extends along the second surface of the filmsubstrate.

According to some example embodiments of the present disclosure, thereis provided a semiconductor package including a substrate including afirst bonding region, a second bonding region, and a chip region that isbetween the first and second bonding regions in a first direction. Thesubstrate may further include first and second surfaces that areopposite to each other. The semiconductor package may include a padgroup including first and second pads that are on the first surface inthe chip region and are spaced apart from each other in a seconddirection that intersects the first direction. The pad group may beadjacent the first bonding region. The semiconductor package may includea first semiconductor chip on the pad group on the first surface. Thesemiconductor package may include a second semiconductor chip on thefirst surface in the chip region, adjacent the first semiconductor chipin the second direction, and closer to the first pad than to the secondpad. The semiconductor package may include a first wire connecting thefirst pad and the second bonding region. The semiconductor package mayinclude a second wire connecting the second pad and the second bondingregion and extending along the first surface of the substrate. The firstwire may include a first via that penetrates the substrate, a firstextended portion that connects the first pad and the first via, and asecond extended portion that connects the first via and the secondbonding region and extends along the second surface of the substrate.

According to some example embodiments of the present disclosure, thereis provided a display device including a film substrate including afirst bonding region, a chip region, and a second bonding region thatare in a sequence in a first direction. The film substrate may furtherinclude first and second surfaces that are opposite to each other. Thedisplay device may include a pad group including input and output padsthat are on the first surface in the chip region and are spaced apartfrom each other in a second direction that intersects the firstdirection. The display device may include a first display driverintegrated circuit (DDI) on the pad group on the first surface. Thedisplay device may include a second DDI on the first surface in the chipregion, adjacent the first DDI in the second direction, and closer tothe output pad than to the input pad. The display device may include aninput wire connecting the input pad and the first bonding region andextending along the first surface of the film substrate. Moreover, thedisplay device may include an output wire connecting the output pad andthe second bonding region and extending at least partially along thesecond surface of the film substrate.

Other features and example embodiments may be apparent from thefollowing detailed description, the drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other example embodiments and features of the presentdisclosure will become more apparent by describing in detail exampleembodiments thereof with reference to the attached drawings, in which:

FIG. 1 is a perspective view of a display device, including asemiconductor package, according to some example embodiments of thepresent disclosure.

FIG. 2 is a layout view of a semiconductor package according to someexample embodiments of the present disclosure.

FIGS. 3 and 4 are cross-sectional views taken along line A-A′ of FIG. 2.

FIGS. 5 and 6 are cross-sectional views illustrating methods ofattaching semiconductor chips on a semiconductor package according tosome example embodiments of the present disclosure.

FIGS. 7 and 8 are layout views of a semiconductor package according tosome example embodiments of the present disclosure.

FIGS. 9 and 10 are cross-sectional views taken along line B-B′ of FIGS.7 and 8.

FIG. 11 is a cross-sectional view taken along line C-C′ of FIGS. 7 and8.

FIGS. 12 and 13 are cross-sectional views taken along line D-D′ of FIGS.7 and 8.

FIGS. 14 and 15 are layout views of a semiconductor package according tosome example embodiments of the present disclosure.

FIGS. 16 and 17 are layout views of a semiconductor package according tosome example embodiments of the present disclosure.

FIGS. 18 and 19 are layout views of a semiconductor package according tosome example embodiments of the present disclosure.

FIGS. 20 and 21 are layout views of a semiconductor package according tosome example embodiments of the present disclosure.

DETAILED DESCRIPTION

Semiconductor packages according to some example embodiments of thepresent disclosure will hereinafter be described with reference to FIGS.1 through 13.

FIG. 1 is a perspective view of a display device, including asemiconductor package, according to some example embodiments of thepresent disclosure.

Referring to FIG. 1, a display device 1000 may include semiconductorpackages 100, a driver printed circuit 400, and a display panel 500.

The semiconductor packages 100 may be connected to the driver printedcircuit 400 and the display panel 500 between the driver printed circuit400 and the display panel 500. The semiconductor packages 100 mayreceive signals from the driver printed circuit 400 and may output thereceived signals to the display panel 500.

The semiconductor packages 100 may be chip-on-film (COF) semiconductorpackages. For example, the semiconductor packages 100 may besemiconductor packages having semiconductor chips attached thereon. Insome example embodiments, each of the semiconductor packages 100 mayinclude two or more semiconductor chips. For example, each of thesemiconductor packages 100 may include first and second semiconductorchips 310 and 320.

The semiconductor packages 100 may be, for example, display driverintegrated circuit (DDI) packages. For example, the first and secondsemiconductor chips 310 and 320 may be DDIs. For example, the first andsecond semiconductor chips 310 and 320 may realize colors by controllingpixels of the display panel 500.

The driver printed circuit 400 may be connected to first sides of thesemiconductor packages 100. For example, the driver printed circuit 400may include driver connecting wires 430, which are formed on the surfaceof the driver printed circuit 400. The driver connecting wires 430 maybe connected to the semiconductor packages 100 and may electricallyconnect the first semiconductor chip 310 and/or the second semiconductorchip 320 of each of the semiconductor packages 100 to the driver printedcircuit 400.

The driver printed circuit 400 may include one or more driver integratedcircuit (IC) chips 410. The driver IC chips 410 may apply power andsignals at the same time to the semiconductor packages 100. The driverprinted circuit 400 may include, for example, a printed circuit board(PCB).

The display panel 500 may be connected to second sides of thesemiconductor packages 100. For example, the display panel 500 mayinclude panel connecting wires 530, which are formed on the surface ofthe display panel 500. The panel connecting wires 530 may be connectedto the semiconductor packages 100 and may electrically connect the firstsemiconductor chip 310 and/or the second semiconductor chip 320 of eachof the semiconductor packages 100 to the display panel 500.

The display panel 500 may include a display substrate 510 and an imageregion 520, which is formed on the display substrate 510. The displaysubstrate 510 may be, for example, a glass substrate or a flexiblesubstrate. In the image region 520, a plurality of pixels may be formed.The pixels of the image region 520 may operate in accordance withsignals provided by the semiconductor packages 100.

The semiconductor packages 100 may be electrically connected to thedisplay panel 500 and may perform the functions of a gate driver or asource driver. For example, the semiconductor packages 100 may beconnected to gate lines of the display panel 500 and may perform thefunctions of a gate driver. Alternatively, the semiconductor packages100 may be connected to source lines of the display panel 500 and mayperform the functions of a source driver.

The display panel 500 may include, for example, at least one of a liquidcrystal display (LCD) panel, a light-emitting diode (LED) panel, anorganic LED (OLED) panel, or a plasma display panel (PDP).

In some example embodiments, a plurality of semiconductor packages 100may be connected between the driver printed circuit 400 and the displaypanel 500. For example, in a case where the display panel 500 is forproviding a large-size screen such as that of a television (TV) or forsupporting high resolution, the display device 1000 may include aplurality of semiconductor packages 100.

In some example embodiments, a single semiconductor package 100 may beconnected between the driver printed circuit 400 and the display panel500. For example, in a case where the display panel 500 is for providinga small-size screen such as that of a mobile phone or for supporting lowresolution, the display device 1000 may include only one semiconductorpackage 100.

In some example embodiments, the semiconductor packages 100 may beconnected to the driver connecting wires 430 of the driver printedcircuit 400 and the panel connecting wires 530 of the display panel 500by anisotropic conductive layers 600.

The anisotropic conductive layers 600 may be, for example, anisotropicconductive films or anisotropic conductive pastes. Each of theanisotropic conductive layers 600 may have a structure in whichconductive particles are dispersed in an insulating adhesive layer. Theanisotropic conductive layers 600 may have an anisotropic electricalcharacteristic. In other words, the anisotropic conductive layers 600may be electrically conductive only in, for example, a verticaldirection, and may be insulative in, for example, a horizontaldirection.

FIG. 2 is a layout view of a semiconductor package according to someexample embodiments of the present disclosure. FIGS. 3 and 4 arecross-sectional views taken along line A-A′ of FIG. 2. For convenience,descriptions of elements or features that have already been describedabove with reference to FIG. 1 may be omitted or at least simplified.Also, for convenience, some wires extending along a substrate, such as afilm substrate 110, are not illustrated.

The semiconductor package according to some example embodiments of thepresent disclosure will hereinafter be described taking thesemiconductor packages 100 of FIG. 1 as an example, but the presentdisclosure is not limited thereto. For example, the semiconductorpackage according to some example embodiments of the present disclosuremay be a system-on-film (SOF) semiconductor package.

Referring to FIGS. 2 through 4, the semiconductor package according tosome example embodiments of the present disclosure includes the filmsubstrate 110, a plurality of first chip pads 315, a plurality of secondchip pads 325, a first bonding pad 144, a second bonding pad 244, athird bonding pad 154, a fourth bonding pad 164, a fifth bonding pad254, a sixth bonding pad 264, a first semiconductor chip 310, a secondsemiconductor chip 320, direct wires 330, a resist film 120, and a moldfilm 130.

The film substrate 110 may include a first bonding region BR1, a chipregion CR, and a second bonding region BR2. The first bonding regionBR1, the chip region CR, and the second bonding region BR2 may be in asequence (e.g., sequentially arranged) in a first direction Y.

For example, the first and second bonding regions BR1 and BR2 may bedisposed at both sides of the film substrate 110, and the chip region CRmay be disposed between the first and second bonding regions BR1 andBR2. For example, the chip region CR may be formed in a middle part ofthe film substrate 110.

The first bonding region BR1 may be, for example, a region of the filmsubstrate 110 to which the driver printed circuit 400 of FIG. 1 isconnected. The second bonding region BR2 may be, for example, a regionof the film substrate 110 to which the display panel 500 of FIG. 1 isconnected. The chip region CR may be, for example, a region of the filmsubstrate 110 where the first and second semiconductor chips 310 and 320are attached. In the chip region CR, the first and second semiconductorchips 310 and 320 may be arranged adjacent to each other in a seconddirection X, which intersects (e.g., is perpendicular to) the firstdirection Y.

The film substrate 110 may include first and second surfaces 110 a and110 b, which are opposite to each other. For example, the first surface110 a may be the top surface of the film substrate 110, and the secondsurface 110 b may be the bottom surface of the film substrate 110.

The film substrate 110 may be, for example, a flexible film. Forexample, the film substrate 110 may be a flexible film comprisingpolyimide or an epoxy resin.

The first chip pads 315 may be formed on the first surface 110 a of thechip region. The first chip pads 315 may be electrically connected tothe first semiconductor chip 310. For example, the first semiconductorchip 310 may be disposed on the first chip pads 315. The first chip pads315 are illustrated in FIG. 2 as being arranged in a row along the edgesof the first semiconductor chip 310, but the present disclosure is notlimited thereto. Alternatively, the first chip pads 315 may be arrangedalong only some of the edges of the first semiconductor chip 310. Stillalternatively, the first chip pads 315 may be arranged in two or morerows along the edges of the first semiconductor chip 310.

Some of the first chip pads 315 may be input pads, and some of the firstchip pads 315 may be output pads. This will be described later in detailwith reference to FIGS. 7 through 13.

In some example embodiments, some of the first chip pads 315 may bedummy pads. For example, some of the first chip pads 315 may not beelectrically connected to bonding pads, and these dummy pads may beformed in the middle part of the chip region CR, but the presentdisclosure is not limited thereto.

The first chip pads 315 may include a first pad group PG1. The first padgroup PG1 may include first chip pads 315 that are arranged in thesecond direction X. The first pad group PG1 may include first chip pads315 that are adjacent to the first bonding region BR1.

The second chip pads 325 may be formed on the first surface 110 a of thechip region CR. The second chip pads 325 may be electrically connectedto the second semiconductor chip 320. For example, the secondsemiconductor chip 320 may be disposed on the second chip pads 325. Thesecond chip pads 325, like the first chip pads 315, are illustrated inFIG. 2 as being arranged in a row along the edges of the secondsemiconductor chip 320, but the present disclosure is not limitedthereto.

Some of the second chip pads 325 may be input pads, and some of thesecond chip pads 325 may be output pads. This will be described later indetail with reference to FIGS. 7 through 13.

In some example embodiments, some of the second chip pads 325 may bedummy pads. For example, some of the second chip pads 325 may not beelectrically connected to bonding pads, and these dummy pads may beformed in the middle part of the chip region CR, but the presentdisclosure is not limited thereto.

The second chip pads 325 may include a second pad group PG2. The secondpad group PG2 may include second chip pads 325 that are arranged in thesecond direction X. The second pad group PG2 may include second chippads 325 that are adjacent to the first bonding region BR1. For example,the second pad group PG2 may be disposed adjacent to the first pad groupPG1 in the second direction X.

The first and second bonding pads 144 and 244 may be formed in the firstbonding region BR1. In some example embodiments, the first and secondbonding pads 144 and 244 may be formed on the first surface 110 a of thefirst bonding region BR1. The first and second bonding pads 144 and 244may be electrically connected to, for example, the driver connectingwires 430 of the driver printed circuit 400 of FIG. 1.

The first and second bonding pads 144 and 244 may be formed in the firstbonding region BR1. For example, the first and second bonding pads 144and 244 may be arranged in parallel in the second direction X.

The third, fourth, fifth, and sixth bonding pads 154, 164, 254, and 264may be formed in the second bonding region BR2. In some exampleembodiments, the third, fourth, fifth, and sixth bonding pads 154, 164,254, and 264 may be formed on the first surface 110 a of the secondbonding region BR2. The third, fourth, fifth, and sixth bonding pads154, 164, 254, and 264 may be electrically connected to, for example,the panel connecting wires 530 of the display panel 500 of FIG. 1.

A plurality of third bonding pads 154 and a plurality of fifth bondingpads 254 may be formed in the second bonding region BR2. For example,the plurality of third bonding pads 154 and the plurality of fifthbonding pads 254 may be formed in parallel in the second direction X.

Similarly, a plurality of fourth bonding pads 164 and a plurality ofsixth bonding pads 264 may be formed in the second bonding region BR2.For example, the plurality of fourth bonding pads 164 and the pluralityof sixth bonding pads 264 may be arranged in parallel in the seconddirection X.

In some example embodiments, the fourth and sixth bonding pads 164 and264 may be closer than the third and fifth bonding pads 154 and 254 tothe chip region CR. For example, the fourth bonding pad 164 may bedisposed between the third bonding pad 154 and the chip region CR, andthe sixth bonding pad 264 may be disposed between the fifth bonding pad254 and the chip region CR.

In some example embodiments, the sum of the number of third bonding pads154 and the number of fourth bonding pads 164 may be greater than thenumber of first bonding pads 144, and the sum of the number of fifthbonding pads 254 and the number of sixth bonding pads 264 may be greaterthan the number of second bonding pads 244.

The number of third bonding pads 154 and the number of fourth bondingpads 164 are illustrated in FIGS. 7 and 8 as being the same, and thenumber of fifth bonding pads 254 and the number of sixth bonding pads264 are illustrated in FIGS. 7 and 8 as being the same. However, thepresent disclosure is not limited to the example of FIGS. 7 and 8. Thatis, alternatively, the number of third bonding pads 154 may be smallerthan the number of fourth bonding pads 164, or vice versa.

The third and fourth bonding pads 154 and 164 may be spaced apart fromeach other, and the fifth and sixth bonding pads 254 and 264 may bespaced apart from each other. The third and fourth bonding pads 154 and164 may be staggered from each other, and the fifth and sixth bondingpads 254 and 264 may be staggered from each other. However, the presentdisclosure is not limited to this. That is, alternatively, the third andfourth bonding pads 154 and 164 may be arranged in line in the firstdirection Y, and the fifth and sixth bonding pads 254 and 264 may bearranged in line in the first direction Y.

The direct wires 330 may connect the first and second bonding regionsBR1 and BR2. For example, the direct wires 330 may extend in the firstdirection Y to connect the first and second bonding regions BR1 and BR2.In some example embodiments, the direct wires 330 may extend along thefirst surface 110 a of the film substrate 110.

Parts of the direct wires 330 in the first bonding region BR1 may beelectrically connected to, for example, the driver connecting wires 430of the driver printed circuit 400 of FIG. 1. Parts of the direct wires330 in the second bonding region BR2 may be electrically connected to,for example, the panel connecting wires 530 of the display panel 500 ofFIG. 1. Accordingly, the direct wires 330 may electrically connect thedriver printed circuit 400 and the display panel 500.

The semiconductor package according to some example embodiments of thepresent disclosure may not include (i.e., may omit) the direct wires330. For example, in some example embodiments, the direct wires 330,which connect the first and second bonding regions BR1 and BR2, may notbe provided.

The resist film 120 may be on (e.g., may cover) the wires on the filmsubstrate 110. Also, the resist film 120 may expose some of the wires onthe film substrate 110. For example, as illustrated in FIGS. 3 and 4,the resist film 120 may expose the first chip pads 315 and the secondchip pads 325.

Accordingly, the first chip pads 315 may be connected to the firstsemiconductor chip 310, and the second chip pads 325 may be connected tothe second semiconductor chip 320. The first chip pads 315 may beelectrically connected to the first semiconductor chip 310 viaconductive bumps, and the second chip pads 325 may be electricallyconnected to the second semiconductor chip 320 via conductive bumps.However, the present disclosure is not limited to this.

The mold film 130 may be formed between the film substrate 110 and thefirst and second semiconductor chips 310 and 320. The mold film 130 maybe on (e.g., may cover) the first chip pads 315 and the second chip pads325.

The mold film 130 may comprise, for example, an epoxy resin. The moldfilm 130 may be formed by, for example, a capillary under-fill method,but the present disclosure is not limited thereto.

As already mentioned above, the first and second semiconductor chips 310and 320 may be adjacent to each other. In some example embodiments, adistance D between the first and second semiconductor chips 310 and 320may be 100 micrometers (μm) or less (i.e., or shorter). In some exampleembodiments, the first and second semiconductor chips 310 and 320 may beplaced in contact with each other.

In some example embodiments, the first and second semiconductor chips310 and 320 may have a height difference. For example, as illustrated inFIG. 4, a first thickness TH1 of the first semiconductor chip 310 and asecond thickness TH2 of the second semiconductor chip 320 may differfrom each other. The first thickness TH1 is illustrated in FIG. 4 asbeing smaller than the second thickness TH2, but the present disclosureis not limited thereto. That is, alternatively, the first thickness TH1may be greater than the second thickness TH2.

FIGS. 5 and 6 are cross-sectional views illustrating methods ofattaching semiconductor chips on a semiconductor package according tosome example embodiments of the present disclosure.

Referring to FIG. 5, first and second semiconductor chips 310 and 320,which are adjacent to each other, may be attached separately on a filmsubstrate 110.

For example, the first semiconductor chip 310 may be attached on thefilm substrate 110 first, and then, the second semiconductor chip 320may be attached on the film substrate 110. The first and secondsemiconductor chips 310 and 320 may be attached on the film substrate110 by, for example, an attachment device 700.

In some example embodiments, the first semiconductor chip 310 may beattached on the film substrate 110, and then, the second semiconductorchip 320, which is thicker than the first semiconductor chip 310, may beattached on the film substrate 110. In this case, even if the width ofthe attachment device 700 is greater than the thickness of the secondsemiconductor chip 320, the second semiconductor chip 320 can be easilyattached near the first semiconductor chip 310. For example, the firstand second semiconductor chips 310 and 320 can be formed to be 100 μm orless apart from each other.

However, the present disclosure is not limited to this. That is, thethickness of the first semiconductor chip 310 and the thickness of thesecond semiconductor chip 320 may be the same depending on how and bywhat the first and second semiconductor chips 310 and 320 are attachedon the film substrate 110.

Referring to FIG. 6, first and second semiconductor chips 310 and 320,which are adjacent to each other, may be attached at the same time on afilm substrate 110.

In some example embodiments, a plurality of semiconductor chips, whichare adjacent to one another, may be cut at once from a wafer, and maythen be attached on the film substrate 110.

For example, the first and second semiconductor chips 310 and 320, whichare adjacent to each other, may be cut at once from the wafer and maythen be attached on the film substrate 110. Accordingly, the first andsecond semiconductor chips 310 and 320 can be easily attached on thefilm substrate 110 to be adjacent to each other. For example, the firstand second semiconductor chips 310 and 320 may be formed on the filmsubstrate 110 to be in contact with each other. For example, scribelines of the wafer may remain between the first and second semiconductorchips 310 and 320.

Semiconductor packages according to some example embodiments of thepresent disclosure will hereinafter be described with reference to FIGS.7 through 13.

FIGS. 7 and 8 are layout views of a semiconductor package according tosome example embodiments of the present disclosure. FIGS. 9 and 10 arecross-sectional views taken along line B-B′ of FIGS. 7 and 8. FIG. 11 isa cross-sectional view taken along line C-C′ of FIGS. 7 and 8. FIGS. 12and 13 are cross-sectional views taken along line D-D′ of FIGS. 7 and 8.For convenience, descriptions of elements or features that have alreadybeen described above with reference to FIGS. 1 through 6 may be omittedor at least simplified. Also, for convenience, first and secondsemiconductor chips 310 and 320 are not illustrated in FIGS. 7 and 8.

FIG. 7 is a layout view illustrating a first surface 110 a of a filmsubstrate 110, and FIG. 8 is a layout view illustrating a second surface110 b of the film substrate 110.

Referring to FIGS. 7 through 13, a first pad group PG1 includes a firstpad 152, a second pad 142, and a third pad 162, and a second pad groupPG2 includes a fourth pad 252, a fifth pad 242, and a sixth pad 262. Thesemiconductor package according to some example embodiments of thepresent disclosure includes a first wire 150, a second wire 140, a thirdwire 160, a fourth wire 250, a fifth wire 240, and a sixth wire 260.

The first, second, and third pads 152, 142, and 162 may be in a sequence(e.g., sequentially arranged) in a second direction X. The first pad 152may be adjacent to the second semiconductor chip 320. For example, thefirst pad 152 may be closer than the second and third pads 142 and 162to the second semiconductor chip 320.

The fourth, fifth, and sixth pads 252, 242, and 262 may be in a sequence(e.g., sequentially arranged) in the second direction X. The fourth pad252 may be adjacent to the first semiconductor chip 310. For example,the fourth pad 252 may be closer than the fifth and sixth pads 242 and262 to the first semiconductor chip 310. In some example embodiments,the fourth pad 252 may be adjacent to the first pad 152.

The first wire 150 may connect the first semiconductor chip 310 and asecond bonding region BR2. For example, the first wire 150 may connectthe first pad 152 and the third bonding pad 154. In some exampleembodiments, the first wire 150 may be an output wire. For example, thefirst wire 150 may electrically connect the first semiconductor chip 310and the display panel 500 of FIG. 1.

In some example embodiments, at least part of the first wire 150 mayextend along the second surface 110 b of the film substrate 110. Forexample, as illustrated in FIG. 9, the first wire 150 may include afirst extended portion 150 a, a first via 150 v 1, a second extendedportion 150 b, and a second via 150 v 2.

The first extended portion 150 a may connect the first pad 152 and thefirst via 150 v 1. The first extended portion 150 a may extend along thefirst surface 110 a of the film substrate 110.

The first via 150 v 1 may penetrate the film substrate 110. The firstvia 150 v 1 may connect the first extended portion 150 a and the secondextended portion 150 b. In some example embodiments, as illustrated inFIGS. 7 and 8, the first via 150 v 1 may be disposed between a chipregion CR and a first bonding region BR1.

The second extended portion 150 b may connect the first via 150 v 1 andthe second via 150 v 2. The second extended portion 150 b may extendalong the second surface 110 b of the film substrate 110. In someexample embodiments, as illustrated in FIG. 9, at least part of thesecond extended portion 150 b may be overlapped by the firstsemiconductor chip 310. Similarly, at least part of a portion (e.g., an“extended portion”) of the fourth wire 250 that extends along the secondsurface 110 b of the film substrate 110 may be overlapped by the secondsemiconductor chip 320. Moreover, in some embodiments, a plurality offirst wires 150 may be overlapped by the first semiconductor chip 310,and/or a plurality of fourth wires 250 may be overlapped by the secondsemiconductor chip 320. As used herein, the terms/expressions “overlap,”“overlapped,” and “two elements overlap” mean that the two elementsoverlap in a vertical direction.

The second via 150 v 2 may penetrate the film substrate 110. The secondvia 150 v 2 may connect the second extended portion 150 b and the thirdbonding pad 154. In some example embodiments, as illustrated in FIGS. 7and 8, the second via 150 v 2 may be disposed in the second bondingregion BR2.

In some example embodiments, the second via 150 v 2 may not be provided(i.e., may be omitted). For example, in a case where the third bondingpad 154 is formed on the second surface 110 b of the second bondingregion BR2, the second via 150 v 2 may not be provided. For example, thesecond extended portion 150 b may be directly connected to the thirdbonding pad 154.

In some example embodiments, the first wire 150 may further include atest wire, which is for testing the characteristics of the firstsemiconductor chip 310. In a case where the first wire 150 comprises anoutput wire, the output characteristic of the first semiconductor chip310 may be tested. For example, as illustrated in FIG. 10, the firstwire 150 may further include a third extended portion 150 c and a firsttest pad 156.

In some example embodiments, the third extended portion 150 c may extendfrom the first pad 152 in a direction toward the first bonding regionBR1. Also, the third extended portion 150 c may extend along the firstsurface 110 a of the film substrate 110. In some example embodiments,the first test pad 156 may be disposed in the first bonding region BR1.On the other hand, in some example embodiments, the first test pad 156may be removed/omitted from the film substrate 110.

The second wire 140 may connect the first semiconductor chip 310 and thefirst bonding region BR1. For example, the second wire 140 may connectthe second pad 142 and the first bonding pad 144. In some exampleembodiments, the second wire 140 may be an input wire. For example, thesecond wire 140 may electrically connect the first semiconductor chip310 and the driver printed circuit 400 of FIG. 1.

In some example embodiments, as illustrated in FIG. 11, the second wire140 may extend along the first surface 110 a of the film substrate 110.The first bonding pad 144 may be exposed by a resist film 120.

The third wire 160 may connect the first semiconductor chip 310 and thesecond bonding region BR2. For example, the third wire 160 may connectthe third pad 162 and the fourth bonding pad 164. In some exampleembodiments, the third wire 160 may be an output wire. For example, thethird wire 160 may electrically connect the first semiconductor chip 310and the display panel 500 of FIG. 1.

In some example embodiments, as illustrated in FIG. 12, the third wire160 may extend along the first surface 110 a of the film substrate 110.The fourth bonding pad 164 may be exposed by the resist film 120.

In some example embodiments, as illustrated in FIG. 7, the third wire160 may extend between the first semiconductor chip 310 and one of thedirect wires 330.

In some example embodiments, the third wire 160 may further include atest wire, which is for testing the characteristics of the firstsemiconductor chip 310. In a case where the third wire 160 is an outputwire, the output characteristic of the first semiconductor chip 310 maybe tested. For example, as illustrated in FIG. 13, the third wire 160may further include a third via 160 v and a second test pad 166.

In some example embodiments, part of the third wire 160 may extend alongthe second surface 110 b of the film substrate 110. In some exampleembodiments, part of the third wire 160 may extend from the third pad162 in a direction toward the second bonding region BR2 via the thirdvia 160 v. In some example embodiments, the second test pad 166 may bedisposed in the second bonding region BR2. On the other hand, in someexample embodiments, the second test pad 166 may be removed/omitted fromthe film substrate 110.

The fourth wire 250 may connect the second semiconductor chip 320 andthe second bonding region BR2. For example, the fourth wire 250 mayconnect the fourth pad 252 and the fifth bonding pad 254. In someexample embodiments, the fourth wire 250 may be an output wire. Forexample, the fourth wire 250 may electrically connect the secondsemiconductor chip 320 and the display panel 500 of FIG. 1.

In some example embodiments, at least part of the fourth wire 250 mayextend along the second surface 110 b of the film substrate 110. Forexample, the fourth wire 250 may include fourth and fifth vias 250 v 1and 250 v 2, which penetrate the film substrate 110. In some exampleembodiments, the fourth via 250 v 1 may be disposed between the chipregion CR and the first bonding region BR1, and the fifth via 250 v 2may be disposed in the second bonding region BR2.

In some example embodiments, the fifth via 250 v 2 may not be provided(i.e., may be omitted). For example, in a case where the fifth bondingpad 254 is formed on the second surface 110 b of the second bondingregion BR2, the fifth via 250 v 2 may not be provided.

The fifth wire 240 may connect the second semiconductor chip 320 and thefirst bonding region BR1. For example, the fifth wire 240 may connectthe fifth pad 242 and the second bonding pad 244. In some exampleembodiments, the fifth wire 240 may be an input wire. For example, thefifth wire 240 may electrically connect the second semiconductor chip320 and the driver printed circuit 400 of FIG. 1.

In some example embodiments, the fifth wire 240 may extend along thefirst surface 110 a of the film substrate 110.

The sixth wire 260 may connect the second semiconductor chip 320 and thesecond bonding region BR2. For example, the sixth wire 260 may connectthe sixth pad 262 and the sixth bonding pad 264. In some exampleembodiments, the sixth wire 260 may be an output wire. For example, thesixth wire 260 may electrically connect the second semiconductor chip320 and the display panel 500 of FIG. 1.

In some example embodiments, the sixth wire 260 may extend along thefirst surface 110 a of the film substrate 110. In some exampleembodiments, the sixth wire 260 may extend between the secondsemiconductor chip 320 and one of the direct wires 330.

As electronic products have become compact in size, thin, andlightweight, the demand for compact semiconductor packages for use insuch electronic products has increased. According to the exampleembodiments of FIGS. 7 through 13, a compact semiconductor package canbe provided by reducing/minimizing the distance between semiconductorchips.

For example, the distance between the first and second semiconductorchips 310 and 320 can be reduced/minimized by forming the first wire150, which is adjacent to the second semiconductor chip 320, to extendalong the second surface 110 b of the film substrate 110. For example,the first and second semiconductor chips 310 and 320 may be formed to beonly about 100 μm or less apart from each other. Accordingly, asemiconductor package that is compact in size, for example, in thesecond direction X, can be provided. If the first wire 150, which isadjacent to the second semiconductor chip 320, extends along only thefirst surface 110 a of the film substrate 110, the first wire 150 mayextend between the first and second semiconductor chips 310 and 320. Inthis case, the distance between the first and second semiconductor chips310 and 320 increases, which, however, adversely affects the downsizingof a semiconductor package.

FIGS. 14 and 15 are layout views of a semiconductor package according tosome example embodiments of the present disclosure. For convenience,descriptions of elements or features that have already been describedabove with reference to FIGS. 1 through 13 may be omitted or at leastsimplified. Also, for convenience, some wires extending along a filmsubstrate 110 are not illustrated in FIGS. 14 and 15.

FIG. 14 is a layout view illustrating a first surface 110 a of a filmsubstrate 110, and FIG. 15 is a layout view illustrating a secondsurface 110 b of the film substrate 110.

Referring to FIGS. 14 and 15, the semiconductor package according tosome example embodiments of the present disclosure includes seventh andeighth wires 170 and 270.

The seventh wire 170 may connect a first semiconductor chip 310 and asecond bonding region BR2. In some example embodiments, the seventh wire170 may be an output wire. For example, the seventh wire 170 mayelectrically connect the first semiconductor chip 310 and the displaypanel 500 of FIG. 1.

At least part of the seventh wire 170 may extend along the secondsurface 110 b of the film substrate 110. For example, the seventh wire170 may include a sixth via 170 v 1, which penetrates the film substrate110. In some example embodiments, the sixth via 170 v 1 may be disposedin a chip region CR. For example, the sixth via 170 v 1 may beoverlapped by the first semiconductor chip 310.

The seventh wire 170 may connect a seventh pad 172 and a third bondingpad 154. In some example embodiments, the seventh pad 172 may be closerto a first pad group PG1 than to the second bonding region BR2.

The eighth wire 270 may connect a second semiconductor chip 320 and thesecond bonding region BR2. In some example embodiments, the eighth wire270 may be an output wire. For example, the eighth wire 270 mayelectrically connect the second semiconductor chip 320 and the displaypanel 500 of FIG. 1.

At least part of the eighth wire 270 may extend along the second surface110 b of the film substrate 110. For example, the eighth wire 270 mayinclude a seventh via 270 v 1, which penetrates the film substrate 110.In some example embodiments, the seventh via 270 v 1 may be disposed inthe chip region CR. For example, the seventh via 270 v 1 may beoverlapped by the second semiconductor chip 320.

The eighth wire 270 may connect an eighth pad 272 and a fifth bondingpad 254. In some example embodiments, the eighth pad 272 may be closerto a second pad group PG2 than to the second bonding region BR2.

FIGS. 16 and 17 are layout views of a semiconductor package according tosome example embodiments of the present disclosure. For convenience,descriptions of elements or features that have already been describedabove with reference to FIGS. 1 through 13 may be omitted or at leastsimplified. Also, for convenience, first and second semiconductor chips310 and 320 are not illustrated in FIGS. 16 and 17.

FIG. 16 is a layout view illustrating a first surface 110 a of a filmsubstrate 110, and FIG. 17 is a layout view illustrating a secondsurface 110 b of the film substrate 110.

Referring to FIGS. 16 and 17, a first via 150 v 1 of a first wire 150may be disposed in a chip region CR. For example, the first via 150 v 1may be overlapped by the first semiconductor chip 310.

In some example embodiments, a fourth via 250 v 1 of a fourth wire 250,like the first via 150 v 1, may be disposed in the chip region CR. Forexample, the fourth via 250 v 1 may be overlapped by the secondsemiconductor chip 320.

FIGS. 18 and 19 are layout views of a semiconductor package according tosome example embodiments of the present disclosure. For convenience,descriptions of elements or features that have already been describedabove with reference to FIGS. 1 through 13 may be omitted or at leastsimplified. Also, for convenience, first and second semiconductor chips310 and 320 are not illustrated in FIGS. 18 and 19.

FIG. 18 is a layout view illustrating a first surface 110 a of a filmsubstrate 110, and FIG. 19 is a layout view illustrating a secondsurface 110 b of the film substrate 110.

Referring to FIGS. 18 and 19, at least part of a third wire 160 mayextend along the second surface 110 b of the film substrate 110. Forexample, the third wire 160 may include an eighth via 160 v 1, whichpenetrates the film substrate 110. In some example embodiments, theeighth via 160 v 1 may be disposed between a chip region CR and a firstbonding region BR1.

In some example embodiments, at least part of a sixth wire 260, like atleast part of the third wire 160, may extend along the second surface110 b of the film substrate 110. For example, the sixth wire 260 mayinclude a ninth via 260 v 1, which penetrates the film substrate 110. Insome example embodiments, the ninth via 260 v 1 may be disposed betweenthe chip region CR and the first bonding region BR1.

As illustrated in FIG. 19, the third and sixth wires 160 and 260 may notoverlap with the chip region CR, but the present disclosure is notlimited thereto. That is, alternatively, at least part of the third wire160 and/or at least part of the sixth wire 260 may overlap with the chipregion CR.

FIGS. 20 and 21 are layout views of a semiconductor package according tosome example embodiments of the present disclosure. For convenience,descriptions of elements or features that have already been describedabove with reference to FIGS. 1 through 15 may be omitted or at leastsimplified. Also, for convenience, first and second semiconductor chips310 and 320 are not illustrated in FIGS. 20 and 21.

FIG. 20 is a layout view illustrating a first surface 110 a of a filmsubstrate 110, and FIG. 21 is a layout view illustrating a secondsurface 110 b of the film substrate 110.

Referring to FIGS. 20 and 21, a first pad group PG1 may further includea ninth pad 182. The semiconductor package according to some exampleembodiments of the present disclosure may further include a ninth wire180.

In some example embodiments, the ninth pad 182 may be closer than afirst pad 152 to the second semiconductor chip 320. For example, theninth pad 182 may be closer than the first pad 152 to a fourth pad 252.

The ninth wire 180 may connect the first semiconductor chip 310 and afirst bonding region BR1. In some example embodiments, the ninth wire180 may be an output wire. For example, the ninth wire 180 mayelectrically connect the first semiconductor chip 310 and the displaypanel 500 of FIG. 1.

The ninth wire 180 may extend between the first and second semiconductorchips 310 and 320. For example, the ninth wire 180 may extend betweenthe first and fourth pads 152 and 252.

In some example embodiments, the ninth wire 180 may extend along thefirst surface 110 a of the film substrate. For example, the ninth wire180 may connect the ninth pad 182 and the fourth bonding pad 164.

The semiconductor package according to some example embodiments of thepresent disclosure may not include (i.e., may omit, be free of) directwires. For example, as illustrated in FIGS. 20 and 21, no direct wires(330 of FIGS. 7 and 8) may be provided to connect the first bondingregion BR1 and a second bonding region BR2.

Although the present inventive concepts have been particularly shown anddescribed with reference to example embodiments thereof, it will beunderstood by those of ordinary skill in the art that various changes inform and details may be made therein without departing from the spiritand scope of the present inventive concepts as defined by the followingclaims. It is therefore desired that the example embodiments beconsidered in all respects as illustrative and not restrictive,reference being made to the appended claims rather than the foregoingdescription to indicate the scope of the inventive concepts.

What is claimed is:
 1. A semiconductor package comprising: a filmsubstrate comprising a first bonding region, a chip region, and a secondbonding region that are in a sequence in a first direction, the filmsubstrate further comprising first and second surfaces that are oppositeto each other; a pad group comprising first, second, and third pads onthe first surface in the chip region and spaced apart from each other ina second direction that intersects the first direction; a firstsemiconductor chip on the pad group on the first surface; a secondsemiconductor chip on the first surface in the chip region, and in asequence in the second direction together with the first semiconductorchip, adjacent the first pad; a first wire connecting the first pad andthe second bonding region; a second wire connecting the second pad andthe first bonding region; and a third wire connecting the third pad andthe second bonding region, wherein the first wire comprises a first viathat penetrates the film substrate, a first extended portion thatconnects the first pad and the first via, and a second extended portionthat connects the first via and the second bonding region and extendsalong the second surface of the film substrate.
 2. The semiconductorpackage of claim 1, wherein at least part of the second extended portionis overlapped by the first semiconductor chip.
 3. The semiconductorpackage of claim 1, further comprising: first and second bonding padsspaced apart from each other on the first surface in the second bondingregion, wherein the first wire connects the first pad and the firstbonding pad, and wherein the third wire connects the third pad and thesecond bonding pad.
 4. The semiconductor package of claim 3, wherein thefirst wire further comprises a second via that is in the second bondingregion.
 5. The semiconductor package of claim 3, wherein the secondbonding pad is closer than the first bonding pad to the chip region. 6.The semiconductor package of claim 1, wherein the first via is betweenthe chip region and the first bonding region.
 7. The semiconductorpackage of claim 1, wherein the first wire further comprises a thirdextended portion that connects the first pad and the first bondingregion and extends along the first surface of the film substrate.
 8. Thesemiconductor package of claim 1, wherein the third wire includes asecond via that is between the chip region and the first bonding region,and wherein at least part of the third wire extends along the secondsurface of the film substrate.
 9. The semiconductor package of claim 1,further comprising: a fourth pad on the first surface in the chip regionadjacent the first pad, the fourth pad being connected to the secondsemiconductor chip; and a fourth wire connecting the fourth pad and thesecond bonding region, wherein the fourth wire comprises a second viathat penetrates the film substrate, a third extended portion thatconnects the fourth pad and the second via, and a fourth extendedportion that connects the second via and the second bonding region andextends along the second surface of the film substrate.
 10. Thesemiconductor package of claim 1, further comprising: a fourth pad onthe first surface in the chip region and closer than the pad group tothe second bonding region, the fourth pad being connected to the firstsemiconductor chip; and a fourth wire connecting the fourth pad and thesecond bonding region, wherein at least part of the fourth wire extendsalong the second surface of the film substrate.
 11. The semiconductorpackage of claim 1, wherein the first and second semiconductor chipscomprise first and second display driver integrated circuits (DDIs),respectively.
 12. The semiconductor package of claim 1, wherein thefirst and third wires comprise respective output wires, and wherein thesecond wire comprises an input wire.
 13. A semiconductor packagecomprising: a film substrate comprising a first bonding region, a chipregion, and a second bonding region that are in a sequence in a firstdirection, and further comprising first and second surfaces that areopposite to each other; a first pad group comprising first and secondpads that are on the first surface in the chip region and are spacedapart from each other in a second direction that intersects the firstdirection; a second pad group comprising a third pad that is on thefirst surface in the chip region and is spaced apart in the seconddirection from the second pad with the first pad therebetween; a firstsemiconductor chip on the first pad group; a second semiconductor chipon the second pad group and adjacent the first semiconductor chip in thesecond direction; a first wire comprising a first via that penetratesthe film substrate, a first extended portion that connects the first padand the first via, and a second extended portion that connects the firstvia and the second bonding region and extends along the second surfaceof the film substrate; a second wire connecting the second pad and thefirst bonding region; and a third wire comprising a second via thatpenetrates the film substrate, a third extended portion that connectsthe third pad and the second via, and a fourth extended portion thatconnects the second via and the second bonding region and extends alongthe second surface of the film substrate.
 14. The semiconductor packageof claim 13, further comprising: a fourth wire extending along the firstsurface of the film substrate, wherein the first pad group furthercomprises a fourth pad that is spaced apart from the first pad with thesecond pad therebetween, and wherein the fourth wire connects the fourthpad and the second bonding region.
 15. The semiconductor package ofclaim 13, further comprising: a fourth wire extending along the firstsurface of the film substrate, wherein the second pad group furthercomprises a fourth pad that is spaced apart from the first pad with thethird pad therebetween, and wherein the fourth wire connects the fourthpad and the first bonding region.
 16. The semiconductor package of claim13, wherein a distance in the second direction between the first andsecond semiconductor chips is 100 micrometers (μm) or shorter.
 17. Asemiconductor package comprising: a substrate comprising a first bondingregion, a second bonding region, and a chip region that is between thefirst and second bonding regions in a first direction, the substratefurther comprising first and second surfaces that are opposite to eachother; a pad group comprising first and second pads that are on thefirst surface in the chip region and are spaced apart from each other ina second direction that intersects the first direction, wherein the padgroup is adjacent the first bonding region; a first semiconductor chipon the pad group on the first surface; a second semiconductor chip onthe first surface in the chip region, adjacent the first semiconductorchip in the second direction, and closer to the first pad than to thesecond pad; a first wire connecting the first pad and the second bondingregion; and a second wire connecting the second pad and the secondbonding region and extending along the first surface of the substrate,wherein the first wire comprises a first via that penetrates thesubstrate, a first extended portion that connects the first pad and thefirst via, and a second extended portion that connects the first via andthe second bonding region and extends along the second surface of thesubstrate.
 18. The semiconductor package of claim 17, furthercomprising: a third wire extending along the first surface of thesubstrate, wherein the pad group further comprises a third pad that isbetween the first and second pads, and wherein the third wire connectsthe third pad and the first bonding region.
 19. The semiconductorpackage of claim 17, further comprising: a third wire between the firstand second semiconductor chips, wherein the pad group further comprisesa third pad that is closer than the first pad to the secondsemiconductor chip, and wherein the third wire connects the third padand the second bonding region.
 20. The semiconductor package of claim17, further comprising: a direct wire extending on the first surface ofthe substrate to connect the first and second bonding regions.